Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) Internship

PROCESS ENGINEER, GOLD-TO-GOLD INTERCONNECT & FLIP-CHIP ASSEMBLY (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth. 

We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners.

RESPONSIBILITIES

• Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength
• Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability
• Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed
• Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection
• Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability
• Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers
• Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports
• Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
• Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies

BASIC QUALIFICATIONS

• Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
• 2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable)

PREFERRED SKILLS AND EXPERIENCE

• 3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
• Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
• Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
• Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination
• DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
• Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
• Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp
• CAD (AutoCAD) and familiarity with simulation tools (ANSYS, COMSOL, or similar) is a plus; data analysis with JMP, Minitab, MATLAB, or Python is a plus
• Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor

ADDITIONAL REQUIREMENTS

• Onsite in Bastrop, TX (not remote or hybrid)
• Up to 20% domestic and international travel for supplier and manufacturing support
• Willingness to work extended hours or weekends to support key milestones
• Ability to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks (including lifting up to 25 lbs and handling wafers, substrates, packages, tooling, and assembly samples)
• Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management